| Jahr Year | Titel/Autor:in Title/Author | Publikationstyp Publication Type |
|---|---|---|
| 2023 | Application of machine learning algorithms in prognostics and health monitoring of electronic systems: A review Bhat, Darshankumar; Münch, Stefan; Röllig, Mike |
Review |
| 2023 | Inline solution for characterization of chip substrate connections by Laser Speckle Photometry Surner, Lennard; Chen, Lili; Bendjus, Beatrice; Cikalova, Ulana; Münch, Stefan |
Konferenzbeitrag Conference Paper |
| 2023 | Estimation of remaining useful lifetime of power electronic components with machine learning based on mission profile data Bhat, Darshankumar; Münch, Stefan; Röllig, Mike |
Zeitschriftenaufsatz Journal Article |
| 2023 | FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure Röllig, Mike; Schwerz, Robert; Meyer, Jörg; Meier, Karsten |
Konferenzbeitrag Conference Paper |
| 2023 | Influence analysis of joint attributes on the fatigue progress of SnAgCu solder joints under thermomechanical loading Berger, Rika; Schwerz, Robert; Röllig, Mike; Heuer, Henning |
Zeitschriftenaufsatz Journal Article |
| 2022 | Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data Bhat, Darshankumar; Münch, Stefan; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2022 | Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing Gleichauf, Jonas; Maniar, Youssef; Kuczynska, Marta; Metasch, René; Röllig, Mike; Wiese, Steffen |
Konferenzbeitrag Conference Paper |
| 2022 | Macro- and Microscopic DMA measurements - Complementary techniques to determine viscoelastic material properties of packaging polymers Clausner, André; Schlipf, Simon; Sander, Christoph; Schwerz, Robert; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2022 | Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data Münch, Stefan; Bhat, Darshankumar; Heindel, Leonhard; Hantschke, Peter; Röllig, Mike; Kästner, Markus |
Konferenzbeitrag Conference Paper |
| 2022 | Electrical diagnostics of passive components failure during reliability testing Wiss, Erik; Metasch, René; Barth, D.; Serea, Vlad; Röllig, Mike; Wiese, Bettina S. |
Konferenzbeitrag Conference Paper |
| 2022 | Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions Metasch, René; Röllig, Mike; Schwerz, Robert; Gleichauf, Jonas; Maniar, Youssef; Ratchev, Roumen; Meier, Kerstin |
Konferenzbeitrag Conference Paper |
| 2022 | A new method for the in vivo identification of degenerated material property ranges of the human eye: Feasibility analysis based on synthetic data Münch, Stefan; Röllig, Mike; Balzani, Daniel |
Zeitschriftenaufsatz Journal Article |
| 2021 | Inline inspection of ceramic tape casting processes by means of optical, eddy current and machine learning methods Heymann, Manuela; Münch, Stefan; Schulze, Martin; Capraro, Beate; Schabbel, Dirk; Gupta, Vidit; Vogel, Andy; Schuster, Christiane; Härtling, Thomas |
Konferenzbeitrag Conference Paper |
| 2021 | Inverse Identification of Material Properties of the Human Eye Using Optical Deformation Measurements Münch, Stefan; Röllig, Mike; Balzani, Daniel |
Zeitschriftenaufsatz Journal Article |
| 2021 | Relevance evaluation of solder joints attributes to reduce the variance of the lifetime model Berger, Rike; Schwerz, Robert; Röllig, Mike; Heuer, Henning |
Konferenzbeitrag Conference Paper |
| 2021 | Optical Deformation Measurement for Validation of Thermo-Mechanical FEM Models and Material Behavior in Electronics Schwerz, Robert; Röllig, Mike; Lautenschläger, Georg |
Konferenzbeitrag Conference Paper |
| 2020 | Simulationsbasierte Optimierung eines Messstandes zur optischen Vermessung von thermo-mechanischen Verformungen Schwerz, Robert; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2020 | Simulationsgestützte Analyse von Through-hole Technology Verbindungsstellen der Elektronik im Automobilbereich Berger, R.; Olfe, Jürgen; Rogowski, Sebastian; Röllig, Mike; Münch, Stefan; Schwerz, Robert; Heuer, Henning |
Konferenzbeitrag Conference Paper |
| 2020 | Characterization of Ceramics based on Laser Speckle Photometry Chen, Lili; Cikalova, Ulana; Münch, Stefan; Bendjus, Beatrice; Röllig, Mike |
Zeitschriftenaufsatz Journal Article |
| 2020 | FEM-study for solder model comparison on solder joints stress-strain effects Schwerz, Robert; Metasch, René; Röllig, Mike; Meier, Karsten |
Konferenzbeitrag Conference Paper |
| 2019 | Stress Characterization of Ceramic Substrates by Laser Speckle Photometry Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice |
Konferenzbeitrag Conference Paper |
| 2019 | Analysis of flip-chip solder joints under isothermal vibration loading Meier, Karsten; Leslie, David; Dasgupta, Abhijit; Röllig, Mike; Bock, Karlheinz |
Konferenzbeitrag Conference Paper |
| 2019 | Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten |
Konferenzbeitrag Conference Paper |
| 2019 | Numerical study on the influence of material models for tin-based solder alloys on reliability statements Metasch, René; Schwerz, Robert; Meier, K.; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2019 | System und Verfahren zur Überwachung der Fertigungsgenauigkeit bei der additiven Herstellung dreidimensionaler Bauteile Bendjus, Beatrice; Cikalova, Ulana; Röllig, Mike |
Patent |
| 2019 | Vorrichtung zur Bestimmung der Ermüdung von Proben, die einer thermo-mechanischen Wechselbeanspruchung ausgesetzt werden Metasch, René; Röllig, Mike; Naumann, Uwe; Kaufmann, Rainer; Wiesenhütter, Felix |
Patent |
| 2019 | Numerical and experimental study of the spatial stress distribution on the cornea surface during a non-contact tonometry examination Münch, Stefan; Röllig, Mike; Spörl, Eberhard; Balzani, Daniel |
Zeitschriftenaufsatz Journal Article |
| 2018 | Solder joint fatigue analysis under combined thermal and vibration loading Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K. |
Konferenzbeitrag Conference Paper |
| 2018 | Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints Metasch, René; Röllig, Mike; Naumann, Uwe; Wiesenhütter, Felix; Kaufmann, R. |
Konferenzbeitrag Conference Paper |
| 2018 | Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics Metasch, René; Meier, Karsten; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2018 | Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly Meier, K.; Metasch, R.; Roellig, M.; Bock, K. |
Zeitschriftenaufsatz Journal Article |
| 2018 | Laser Speckle Photometry for Stress Measuring at Industrial Components Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice |
Konferenzbeitrag Conference Paper |
| 2018 | Reliability analysis of encapsulated components in 3D-circuit board integration Schwerz, Robert; Röllig, Mike; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2018 | Langzeitzuverlässige Füllstandsmessung durch ein faserverbundintegriertes Elektroniksystem Schwerz, Robert; Röllig, Mike; Weißenborn, Oliver; Geller, Sirko; Modler, Niels; Sauer, Sebastian |
Konferenzbeitrag Conference Paper |
| 2018 | Zuverlässigkeitsanalyse von gekapselten Bauelementen in der 3D-Leiterplattenintegration Schwerz, Robert |
Dissertation Doctoral Thesis |
| 2018 | Experimental determination of the Young's modulus of copper and solder materials for electronic packaging Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen |
Zeitschriftenaufsatz Journal Article |
| 2018 | Verfahren zur Bestimmung von mechanischen Spannungen in Substraten oder Schaltungsträgern, die mit einem keramischen Werkstoff gebildet sind Bendjus, Beatrice; Cikalova, Ulana; Münch, Stefan; Röllig, Mike |
Patent |
| 2018 | Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan |
Zeitschriftenaufsatz Journal Article |
| 2018 | Heat haze effects in thermal chamber tensile tests on digital image correlation Yuile, Adam; Schwerz, Robert; Röllig, Mike; Metasch, René; Wiese, Steffen |
Konferenzbeitrag Conference Paper |
| 2018 | Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K. |
Konferenzbeitrag Conference Paper |
| 2018 | Experimental Verification of FE-Models for Thermo-Mechanical Loading using Digital Image Correlation Schwerz, Robert; Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2018 | Developments for highly reliable electronics - experiments on combined thermal and vibration loading Meier, Karsten; Röllig, Mike; Bock, Karlheinz |
Konferenzbeitrag Conference Paper |
| 2017 | A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application Münch, Stefan; Röllig, Mike; Cikalova, Ulana; Bendjus, Beatrice; Chen, Lili; Lautenschläger, Georg; Sudip, Shohag Roy |
Konferenzbeitrag Conference Paper |
| 2017 | Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan |
Konferenzbeitrag Conference Paper |
| 2017 | Method for the development of realistic boundary conditions for the simulation of non-contact tonometry Münch, Stefan; Balzani, Daniel; Röllig, Mike; Spörl, Eberhard |
Zeitschriftenaufsatz Journal Article |
| 2017 | Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz |
Konferenzbeitrag Conference Paper |
| 2017 | Experimental determination of the Young's modulus of various electronic packaging materials Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten |
Konferenzbeitrag Conference Paper |
| 2017 | Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana |
Konferenzbeitrag Conference Paper |
| 2017 | Sensorfunktion im Faserverbund Lätzsch, Hans-Joachim; Modler, Niels; Geller, Sirko; Weißenborn, Oliver; Röllig, Mike; Schwerz, Robert; Müller, Uwe; Sauer, Sebastian |
Zeitschriftenaufsatz Journal Article |
| 2016 | Robust and reliable encapsulation of electronics for underwater applications Schwerz, Robert; Röllig, Mike; Frankenstein, Bernd |
Konferenzbeitrag Conference Paper |
| 2016 | Entwicklung einer Pro-aktiven Lötstellengeometrie-unabhängigen Lebensdauersimulation für bleifrei Lote Metais, Benjamin; Kabakchiev, Alexander; Guyenot, Michael; Metasch, René; Röllig, Mike; Buhl, Patrick; Weihe, Stefan |
Konferenzbeitrag Conference Paper |
| 2016 | Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg |
Konferenzbeitrag Conference Paper |
| 2016 | NDE applications in microelectronic industries Meyendorf, Norbert; Oppermann, Martin; Krüger, Peter; Röllig, Mike; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2016 | Multi-scale radiographic applications in microelectronic industry Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried |
Konferenzbeitrag Conference Paper |
| 2016 | Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen Meier, Karsten; Röllig, Mike; Bock, Karlheinz |
Konferenzbeitrag Conference Paper |
| 2016 | Messverfahren zur thermo-mechanischen Charakterisierung von Werkstoffen der Hochtemperatur-AVT Metasch, René; Klemm, Alexander; Röllig, Mike; Zerna, Thomas |
Konferenzbeitrag Conference Paper |
| 2015 | Ringversuche zur Blitzthermografie Rothbart, N.; Maierhofer, C.; Röllig, M.; Sengebusch, M.; Goldammer, M.; Hohlstein, F.; Koch, J.; Kryukov, I.; Mahler, G.; Stotter, B.; Walle, G. |
Konferenzbeitrag Conference Paper |
| 2015 | A viscoplastic-fatigue-creep damage model for tin-based solder alloy Metais, Benjamin; Kabakchiev, Alexander; Maniar, Youssef; Guyenot, Michael; Metasch, René; Röllig, Mike; Rettenmeier, Philipp; Buhl, Patrick; Weihe, Stefan |
Konferenzbeitrag Conference Paper |
| 2015 | Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications Meier, Karsten; Röllig, Mike; Bock, K. |
Konferenzbeitrag Conference Paper |
| 2014 | Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for finite element calculations Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Guyenot, Michael; Buhl, P.; Hossfeld, M.; Metasch, René; Röllig, Mike |
Konferenzbeitrag Conference Paper |
| 2014 | Zuverlässigkeitspotential von eingebetteten passiven und aktiven Bauelementen für die sensorische Strukturüberwachung Schwerz, Robert; Röllig, Mike; Franke, M.; Lautenschläger, Georg; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2014 | Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung Meier, Karsten; Lautenschläger, Georg; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2014 | Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading Meier, Karsten; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2014 | Reliability assessment of discrete passive components embedded into PCB core Schwerz, Robert; Röllig, Mike; Osmolovskyi, Sergii; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2014 | Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung Meier, Karsten; Lautenschläger, Georg; Wolter, Klaus-Jürgen; Röllig, Mike; Schießl, Andreas |
Zeitschriftenaufsatz Journal Article |
| 2014 | Filter-based interrogation of fiber bragg grating sensors Wuchrer, Roland; Lautenschläger, Harald; Metasch, René; Röllig, Mike; Fleischer, Thomas; Härtling, Thomas |
Konferenzbeitrag Conference Paper |
| 2014 | Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen |
Konferenzbeitrag Conference Paper |
| 2014 | Zuverlässigkeitsbewertung von elektrischen und mechanischen Verbindungen mit dem iQPro-Demonstrator Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen; Meyendorf, Norbert |
Konferenzbeitrag Conference Paper |
| 2013 | Determination of the life-time of solder joints under temperature and vibration loadings Meier, Karsten; Röllig, Mike; Lautenschlaeger, Georg; Schießl, Andreas; Wolter, Klaus-Jürgen; Meyendorf, Norbert |
Konferenzbeitrag Conference Paper |
| 2010 | Packaging for radiation resistant X-ray detectors Lohse, T.; Oppermann, M.; Metasch, R.; Zerna, T.; Seilmayer, M.; Wolter, K. |
Konferenzbeitrag Conference Paper |
| 2010 | Characterisation of the mechanical behaviour of SAC solder at high strain rates Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. |
Konferenzbeitrag Conference Paper |
| 2010 | Rate dependent mechanical behaviour of SAC solder in fast tensile experiments Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. |
Konferenzbeitrag Conference Paper |
| 2010 | Mechanical behaviour of typical lead-free solders at high strain rate conditions Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J. |
Konferenzbeitrag Conference Paper |
| 2010 | Moisture induced change of the viscoelastic material properties of adhesives for SHM sensor applications Boehme, B.; Röllig, M.; Wolter, K.-J. |
Konferenzbeitrag Conference Paper |