Jahr
Year
Titel/Autor:in
Title/Author
Publikationstyp
Publication Type
2024 Non-linear viscoelastic Material Models of Polymers for Electronics Simulation - Measurement, Modelling, Validation
Schwerz, Robert; Röllig, Mike
Konferenzbeitrag
Conference Paper
2024 Application oriented On-The-Edge Capable Prognostic and Health Monitoring Framework for Solder Joints in Electronics
Bhat, Darshankumar; Münch, Stefan; Röllig, Mike
Konferenzbeitrag
Conference Paper
2024 Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles
Forndran, Freerik; Sprenger, Mario; Barrera, Juan Ricardo; Steinau, Martin; Röllig, Mike; Münch, Stefan
Konferenzbeitrag
Conference Paper
2023 Application of machine learning algorithms in prognostics and health monitoring of electronic systems: A review
Bhat, Darshankumar; Münch, Stefan; Röllig, Mike
Review
2023 Inline solution for characterization of chip substrate connections by Laser Speckle Photometry
Surner, Lennard; Chen, Lili; Bendjus, Beatrice; Cikalova, Ulana; Münch, Stefan
Konferenzbeitrag
Conference Paper
2023 Estimation of remaining useful lifetime of power electronic components with machine learning based on mission profile data
Bhat, Darshankumar; Münch, Stefan; Röllig, Mike
Zeitschriftenaufsatz
Journal Article
2023 FEM Modelling of Ag-Sinter Joints with Respect of Porosity and Sinter Pressure
Röllig, Mike; Schwerz, Robert; Meyer, Jörg; Meier, Karsten
Konferenzbeitrag
Conference Paper
2023 Influence analysis of joint attributes on the fatigue progress of SnAgCu solder joints under thermomechanical loading
Berger, Rika; Schwerz, Robert; Röllig, Mike; Heuer, Henning
Zeitschriftenaufsatz
Journal Article
2022 Performance Assessment of different Machine Learning Algorithm for Life-Time Prediction of Solder Joints based on Synthetic Data
Münch, Stefan; Bhat, Darshankumar; Heindel, Leonhard; Hantschke, Peter; Röllig, Mike; Kästner, Markus
Konferenzbeitrag
Conference Paper
2022 Macro- and Microscopic DMA measurements - Complementary techniques to determine viscoelastic material properties of packaging polymers
Clausner, André; Schlipf, Simon; Sander, Christoph; Schwerz, Robert; Röllig, Mike
Konferenzbeitrag
Conference Paper
2022 Electrical diagnostics of passive components failure during reliability testing
Wiss, Erik; Metasch, René; Barth, D.; Serea, Vlad; Röllig, Mike; Wiese, Bettina S.
Konferenzbeitrag
Conference Paper
2022 Optimized TMF Measurement Setup for Reproducible Lifetime Measurements on Solder Joints Under Accelerated Thermal-Mechanical Conditions
Metasch, René; Röllig, Mike; Schwerz, Robert; Gleichauf, Jonas; Maniar, Youssef; Ratchev, Roumen; Meier, Kerstin
Konferenzbeitrag
Conference Paper
2022 Damage Prediction and Remaining Useful Lifetime Assessment of a Discrete Power Electronic Component Using a Multi-Layer Perceptron based on Mission Profile Data
Bhat, Darshankumar; Münch, Stefan; Röllig, Mike
Konferenzbeitrag
Conference Paper
2022 Finite-Element Modeling of the Visco-Plastic Shear-Dominant Deformation Behavior of a Creep-Resistant Sn-Based Solder Alloy under TMF Testing
Gleichauf, Jonas; Maniar, Youssef; Kuczynska, Marta; Metasch, René; Röllig, Mike; Wiese, Steffen
Konferenzbeitrag
Conference Paper
2022 A new method for the in vivo identification of degenerated material property ranges of the human eye: Feasibility analysis based on synthetic data
Münch, Stefan; Röllig, Mike; Balzani, Daniel
Zeitschriftenaufsatz
Journal Article
2021 Optical Deformation Measurement for Validation of Thermo-Mechanical FEM Models and Material Behavior in Electronics
Schwerz, Robert; Röllig, Mike; Lautenschläger, Georg
Konferenzbeitrag
Conference Paper
2021 Relevance evaluation of solder joints attributes to reduce the variance of the lifetime model
Berger, Rike; Schwerz, Robert; Röllig, Mike; Heuer, Henning
Konferenzbeitrag
Conference Paper
2021 Inline inspection of ceramic tape casting processes by means of optical, eddy current and machine learning methods
Heymann, Manuela; Münch, Stefan; Schulze, Martin; Capraro, Beate; Schabbel, Dirk; Gupta, Vidit; Vogel, Andy; Schuster, Christiane; Härtling, Thomas
Konferenzbeitrag
Conference Paper
2021 Inverse Identification of Material Properties of the Human Eye Using Optical Deformation Measurements
Münch, Stefan; Röllig, Mike; Balzani, Daniel
Zeitschriftenaufsatz
Journal Article
2020 Simulationsbasierte Optimierung eines Messstandes zur optischen Vermessung von thermo-mechanischen Verformungen
Schwerz, Robert; Röllig, Mike
Konferenzbeitrag
Conference Paper
2020 Simulationsgestützte Analyse von Through-hole Technology Verbindungsstellen der Elektronik im Automobilbereich
Berger, R.; Olfe, Jürgen; Rogowski, Sebastian; Röllig, Mike; Münch, Stefan; Schwerz, Robert; Heuer, Henning
Konferenzbeitrag
Conference Paper
2020 Characterization of Ceramics based on Laser Speckle Photometry
Chen, Lili; Cikalova, Ulana; Münch, Stefan; Bendjus, Beatrice; Röllig, Mike
Zeitschriftenaufsatz
Journal Article
2020 FEM-study for solder model comparison on solder joints stress-strain effects
Schwerz, Robert; Metasch, René; Röllig, Mike; Meier, Karsten
Konferenzbeitrag
Conference Paper
2019 Methodology for correlation of porosity and mechanical properties of silver sintered joints in electronics
Metasch, René; Röllig, Mike; Knoch, Philip; Weinmann, Christian; Meier, Karsten
Konferenzbeitrag
Conference Paper
2019 System und Verfahren zur Überwachung der Fertigungsgenauigkeit bei der additiven Herstellung dreidimensionaler Bauteile
Bendjus, Beatrice; Cikalova, Ulana; Röllig, Mike
Patent
2019 Numerical study on the influence of material models for tin-based solder alloys on reliability statements
Metasch, René; Schwerz, Robert; Meier, K.; Röllig, Mike
Konferenzbeitrag
Conference Paper
2019 Stress Characterization of Ceramic Substrates by Laser Speckle Photometry
Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice
Konferenzbeitrag
Conference Paper
2019 Analysis of flip-chip solder joints under isothermal vibration loading
Meier, Karsten; Leslie, David; Dasgupta, Abhijit; Röllig, Mike; Bock, Karlheinz
Konferenzbeitrag
Conference Paper
2019 Numerical and experimental study of the spatial stress distribution on the cornea surface during a non-contact tonometry examination
Münch, Stefan; Röllig, Mike; Spörl, Eberhard; Balzani, Daniel
Zeitschriftenaufsatz
Journal Article
2019 Vorrichtung zur Bestimmung der Ermüdung von Proben, die einer thermo-mechanischen Wechselbeanspruchung ausgesetzt werden
Metasch, René; Röllig, Mike; Naumann, Uwe; Kaufmann, Rainer; Wiesenhütter, Felix
Patent
2018 Zuverlässigkeitsanalyse von gekapselten Bauelementen in der 3D-Leiterplattenintegration
Schwerz, Robert
Dissertation
Doctoral Thesis
2018 Reliability analysis of encapsulated components in 3D-circuit board integration
Schwerz, Robert; Röllig, Mike; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2018 Experimental determination of the Young's modulus of copper and solder materials for electronic packaging
Krämer, Frank; Röllig, Mike; Metasch, René; Ahmar, Joseph Al; Meier, Karsten; Wiese, Steffen
Zeitschriftenaufsatz
Journal Article
2018 Langzeitzuverlässige Füllstandsmessung durch ein faserverbundintegriertes Elektroniksystem
Schwerz, Robert; Röllig, Mike; Weißenborn, Oliver; Geller, Sirko; Modler, Niels; Sauer, Sebastian
Konferenzbeitrag
Conference Paper
2018 Verfahren zur Bestimmung von mechanischen Spannungen in Substraten oder Schaltungsträgern, die mit einem keramischen Werkstoff gebildet sind
Bendjus, Beatrice; Cikalova, Ulana; Münch, Stefan; Röllig, Mike
Patent
2018 Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Zeitschriftenaufsatz
Journal Article
2018 Solder joint fatigue analysis under combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Liu, Y.; Bock, K.
Konferenzbeitrag
Conference Paper
2018 Thermo-Mechanical Measurement Approach of Ag-sintered Joints for Power Electronics
Metasch, René; Meier, Karsten; Röllig, Mike
Konferenzbeitrag
Conference Paper
2018 Laser Speckle Photometry for Stress Measuring at Industrial Components
Chen, Lili; Cikalova, Ulana; Münch, Stefan; Röllig, Mike; Bendjus, Beatrice
Konferenzbeitrag
Conference Paper
2018 Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, K.; Metasch, R.; Roellig, M.; Bock, K.
Zeitschriftenaufsatz
Journal Article
2018 Experimental Verification of FE-Models for Thermo-Mechanical Loading using Digital Image Correlation
Schwerz, Robert; Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2018 Novel concept of an in-situ test system for the thermal-mechanical fatigue measurement for reliability evaluation of electronic solder joints
Metasch, René; Röllig, Mike; Naumann, Uwe; Wiesenhütter, Felix; Kaufmann, R.
Konferenzbeitrag
Conference Paper
2018 Heat haze effects in thermal chamber tensile tests on digital image correlation
Yuile, Adam; Schwerz, Robert; Röllig, Mike; Metasch, René; Wiese, Steffen
Konferenzbeitrag
Conference Paper
2018 Setup für Ermüdungsversuche an elektronischen Komponenten unter kombinierten Temperatur- und Vibrationslasten
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, K.
Konferenzbeitrag
Conference Paper
2018 Developments for highly reliable electronics - experiments on combined thermal and vibration loading
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Konferenzbeitrag
Conference Paper
2017 Method for the development of realistic boundary conditions for the simulation of non-contact tonometry
Münch, Stefan; Balzani, Daniel; Röllig, Mike; Spörl, Eberhard
Zeitschriftenaufsatz
Journal Article
2017 Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Weihe, Stefan
Konferenzbeitrag
Conference Paper
2017 Accelerated life time measurement with in-situ force and displacement monitoring during thermal cycling on solder joints
Metasch, René; Röllig, Mike; Kuczynska, Marta; Schafet, Natalja; Becker, Ulrich; Meier, Karsten; Panchenko, Iuliana
Konferenzbeitrag
Conference Paper
2017 Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly
Meier, Karsten; Metasch, René; Röllig, Mike; Bock, Karlheinz
Konferenzbeitrag
Conference Paper
2017 Experimental determination of the Young's modulus of various electronic packaging materials
Krämer, Frank; Röllig, Mike; Metasch, René; Wiese, Steffen; Al Ahmar, Joseph; Meier, Karsten
Konferenzbeitrag
Conference Paper
2017 Sensorfunktion im Faserverbund
Lätzsch, Hans-Joachim; Modler, Niels; Geller, Sirko; Weißenborn, Oliver; Röllig, Mike; Schwerz, Robert; Müller, Uwe; Sauer, Sebastian
Zeitschriftenaufsatz
Journal Article
2017 A laser speckle photometry based non-destructive method for measuring stress conditions in direct-copper-bonded ceramics for power electronic application
Münch, Stefan; Röllig, Mike; Cikalova, Ulana; Bendjus, Beatrice; Chen, Lili; Lautenschläger, Georg; Sudip, Shohag Roy
Konferenzbeitrag
Conference Paper
2016 NDE applications in microelectronic industries
Meyendorf, Norbert; Oppermann, Martin; Krüger, Peter; Röllig, Mike; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2016 Zuverlässigkeitsuntersuchungen an organischen Leiterplatten mit dickem Kupferkern für leistungselektronische Anwendungen
Meier, Karsten; Röllig, Mike; Bock, Karlheinz
Konferenzbeitrag
Conference Paper
2016 Messverfahren zur thermo-mechanischen Charakterisierung von Werkstoffen der Hochtemperatur-AVT
Metasch, René; Klemm, Alexander; Röllig, Mike; Zerna, Thomas
Konferenzbeitrag
Conference Paper
2016 Entwicklung einer Pro-aktiven Lötstellengeometrie-unabhängigen Lebensdauersimulation für bleifrei Lote
Metais, Benjamin; Kabakchiev, Alexander; Guyenot, Michael; Metasch, René; Röllig, Mike; Buhl, Patrick; Weihe, Stefan
Konferenzbeitrag
Conference Paper
2016 Sprödbruchrisiko an keramischen Bauelementen in Abhängigkeit vom Hochtemperatur-Lotwerkstoff und der Beanspruchungsgeschwindigkeit
Dudek, Rainer; Hildebrandt, Marcus; Rzepka, Sven; Röllig, Mike; Trodler, Jörg
Konferenzbeitrag
Conference Paper
2016 Robust and reliable encapsulation of electronics for underwater applications
Schwerz, Robert; Röllig, Mike; Frankenstein, Bernd
Konferenzbeitrag
Conference Paper
2016 Multi-scale radiographic applications in microelectronic industry
Gluch, Jürgen; Löffler, Markus; Meyendorf, Norbert G.; Oppermann, Martin; Röllig, Mike; Sättler, P.; Wolter, Klaus-Jürgen; Zschech, Ehrenfried
Konferenzbeitrag
Conference Paper
2015 Ringversuche zur Blitzthermografie
Rothbart, N.; Maierhofer, C.; Röllig, M.; Sengebusch, M.; Goldammer, M.; Hohlstein, F.; Koch, J.; Kryukov, I.; Mahler, G.; Stotter, B.; Walle, G.
Konferenzbeitrag
Conference Paper
2015 A viscoplastic-fatigue-creep damage model for tin-based solder alloy
Metais, Benjamin; Kabakchiev, Alexander; Maniar, Youssef; Guyenot, Michael; Metasch, René; Röllig, Mike; Rettenmeier, Philipp; Buhl, Patrick; Weihe, Stefan
Konferenzbeitrag
Conference Paper
2015 Reliability study on SMD components on an organic substrate with a thick copper core for power electronics applications
Meier, Karsten; Röllig, Mike; Bock, K.
Konferenzbeitrag
Conference Paper
2014 Lebensdauerbestimmung für Lotkontakte von SMD-Bauelementen unter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2014 Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten; Röllig, Mike; Schießl, Andreas; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2014 Reliability assessment of discrete passive components embedded into PCB core
Schwerz, Robert; Röllig, Mike; Osmolovskyi, Sergii; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2014 Lebensdauer von SMD-Lotkontakten unter kombinierter Vibrations- und Temperaturbelastung
Meier, Karsten; Lautenschläger, Georg; Wolter, Klaus-Jürgen; Röllig, Mike; Schießl, Andreas
Zeitschriftenaufsatz
Journal Article
2014 Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronics
Metasch, René; Röllig, Mike; Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Meier, Karsten; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2014 Filter-based interrogation of fiber bragg grating sensors
Wuchrer, Roland; Lautenschläger, Harald; Metasch, René; Röllig, Mike; Fleischer, Thomas; Härtling, Thomas
Konferenzbeitrag
Conference Paper
2014 Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for finite element calculations
Kabakchiev, Alexander; Metais, B.; Ratchev, Roumen; Guyenot, Michael; Buhl, P.; Hossfeld, M.; Metasch, René; Röllig, Mike
Konferenzbeitrag
Conference Paper
2014 Zuverlässigkeitsbewertung von elektrischen und mechanischen Verbindungen mit dem iQPro-Demonstrator
Metasch, René; Röllig, Mike; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Konferenzbeitrag
Conference Paper
2014 Zuverlässigkeitspotential von eingebetteten passiven und aktiven Bauelementen für die sensorische Strukturüberwachung
Schwerz, Robert; Röllig, Mike; Franke, M.; Lautenschläger, Georg; Wolter, Klaus-Jürgen
Konferenzbeitrag
Conference Paper
2013 Determination of the life-time of solder joints under temperature and vibration loadings
Meier, Karsten; Röllig, Mike; Lautenschlaeger, Georg; Schießl, Andreas; Wolter, Klaus-Jürgen; Meyendorf, Norbert
Konferenzbeitrag
Conference Paper
2010 Mechanical behaviour of typical lead-free solders at high strain rate conditions
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
Conference Paper
2010 Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
Conference Paper
2010 Characterisation of the mechanical behaviour of SAC solder at high strain rates
Meier, K.; Röllig, M.; Wiese, S.; Wolter, K.-J.
Konferenzbeitrag
Conference Paper
2010 Packaging for radiation resistant X-ray detectors
Lohse, T.; Oppermann, M.; Metasch, R.; Zerna, T.; Seilmayer, M.; Wolter, K.
Konferenzbeitrag
Conference Paper
2010 Moisture induced change of the viscoelastic material properties of adhesives for SHM sensor applications
Boehme, B.; Röllig, M.; Wolter, K.-J.
Konferenzbeitrag
Conference Paper
Diese Liste ist ein Auszug aus der Publikationsplattform Fraunhofer-Publica

This list has been generated from the publication platform Fraunhofer-Publica